Fully Tested
We use Blackbelt Smartphone Defence to fully test all of our phones and securely data wipe each device.
Tests include:
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Description
Description
LANCER BLADE DDR5SLEEK EFFICIENCY, COMPACT POWER
Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.
Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.
Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.
Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.
AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.
Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
Specifications
Memory | |
---|---|
Package type | Blister |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 45 |
Memory voltage | 1.1,1.4 V |
ECC | Yes |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Power | |
Memory voltage | 1.1,1.4 V |
Design | |
Cooling type | Heatsink |
Technical details | |
Cooling type | Heatsink |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 1 x 16 GB |
Internal memory | 16 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 45 |
Memory voltage | 1.1,1.4 V |
Cooling type | Heatsink |
ECC | Yes |
Memory clock speed | 5600 MHz |
Internal memory type | DDR5 |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -20 - 65 °C |
Weight & dimensions | |
Width | 33.8 mm |
Depth | 133.3 mm |
Height | 7.8 mm |
Weight | 32.9 g |
Package type | Blister |
Packaging data | |
Package type | Blister |

Premium (Grade A): Excellent Cosmetic Condition- May have some very minor scratches/ Scuff marks on the back and/or chassis, including general wear and tear around the ports. These mobile phones are just like new, they have minimal, if any signs of use and are fully functional. The difference between a A Grade phone and a new phone is usually the lack of the original box and/or accessories.
Great (Grade B): Good Condition- May have some minor scratches or scuffs. This grade is given to used mobile phones that carry signs of use. There is a possibility of the phone having minor scratches or scuffs on the screen and/or housing (the Back to you and me) including general wear and tear around the ports. This is a fully functional phone. Again the difference between a grade B phone and a new phone is the lack of the original box and/or accessories.
Fair (Grade C): Average Cosmetic Condition- Will have some scratch marks and or signs of use. This grade is given to used mobile phones with signs of regular use. There is a high
possibility that mobile phones of this grade will come with scratches and/or scruff marks.
We sell our phones complete with a compatible Charging lead and a Box.
This means no further items need to be purchased.
Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.