Fully Tested
We use Blackbelt Smartphone Defence to fully test all of our phones and securely data wipe each device.
Tests include:
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Description
Key Features
- Enhanced RGB lighting with new heat spreader design*
- Patented Kingston FURY Infrared Sync Technology™
- Intel® XMP 3.0 Certified
- AMD EXPO certified
- Qualified by the world’s leading motherboard manufacturers**
- Improved stability for overclocking
Description
Kingston FURY™ Beast DDR5 RGB Memory - up to 6800MT/sKingston FURY™ Beast DDR5 RGB delivers speeds of up to 6800MT/s. Featuring Infrared Sync Technology™ to keep the vibrant customisable lighting in perfect sync, available with sleek black or white heat spreaders and support for Intel® XMP 3.0 and AMD EXPO™, it’s 100% speed tested and backed by a limited lifetime warranty.
Kingston FURY™ Beast DDR5 RGB* lets you overclock in style on next-gen gaming platforms with cutting-edge technology. Experience the superior speed advancements of DDR5 with double the banks and double the burst length.
Vibrant RGB lighting customisable with Kingston FURY CTRL software and patented Infrared Sync TechnologyTM, along with the new heat spreader designs in black or white, sets you apart in and out of the game.
Kingston FURY Beast DDR5 RGB features Intel XMP 3.0 or AMD EXPO options, two new DDR5 overclock specs that include customisable profiles for speeds and timings. 100% tested at speed and backed by a limited lifetime warranty.
Enhanced lighting with new heat spreader design
Game in style by customising the black or white heat spreaders with the smooth, stunning range of 18 RGB lighting* effects using Kingston FURY CTRL™ or the motherboard manufacturer’s software.
Patented Kingston FURY Infrared Sync Technology™
Vibrant RGB effects light in unison with Kingston’s patented Infrared Sync Technology.
Intel® XMP 3.0 certified
Advanced pre-optimised timings, speed and voltage for overclocking performance and save new user-customisable profiles using a programmable PMIC.
AMD EXPO certified
AMD EXPO (Extended Profiles for Overclocking) Certified modules include Intel XMP 3.0 profiles, enabling compatibility with the platform of your choice.
Qualified by the world’s leading motherboard manufacturers**
Tested and trusted for your preferred motherboard so you can build with confidence.
Improved stability for overclocking
On-die ECC (ODECC) helps maintain data integrity to sustain ultimate performance
Specifications
Power | |
---|---|
Memory voltage | 1.25 V |
Design | |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Unregistered (unbuffered) |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 2 x 16 GB |
Internal memory | 32 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 2048M x 64 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
AMD Extended Profiles for Overclocking (EXPO) version | 1.0 |
AMD Extended Profiles for Overclocking (EXPO) | Yes |
Memory data transfer rate | 5200 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Width | 7.11 mm |
Depth | 133.3 mm |
Height | 42.2 mm |
Weight | 84.76 g |
Package weight | 133.11 g |
Packaging data | |
Package width | 121.9 mm |
Package depth | 14 mm |
Package height | 171.4 mm |
Package weight | 133.11 g |
Logistics data | |
Master (outer) case width | 181.6 mm |
Master (outer) case length | 254 mm |
Master (outer) case height | 147.3 mm |
Master (outer) case gross weight | 2.19 kg |
Products per master (outer) case | 15 pc(s) |
Other features | |
Country of origin | China, Taiwan |

Premium (Grade A): Excellent Cosmetic Condition- May have some very minor scratches/ Scuff marks on the back and/or chassis, including general wear and tear around the ports. These mobile phones are just like new, they have minimal, if any signs of use and are fully functional. The difference between a A Grade phone and a new phone is usually the lack of the original box and/or accessories.
Great (Grade B): Good Condition- May have some minor scratches or scuffs. This grade is given to used mobile phones that carry signs of use. There is a possibility of the phone having minor scratches or scuffs on the screen and/or housing (the Back to you and me) including general wear and tear around the ports. This is a fully functional phone. Again the difference between a grade B phone and a new phone is the lack of the original box and/or accessories.
Fair (Grade C): Average Cosmetic Condition- Will have some scratch marks and or signs of use. This grade is given to used mobile phones with signs of regular use. There is a high
possibility that mobile phones of this grade will come with scratches and/or scruff marks.
We sell our phones complete with a compatible Charging lead and a Box.
This means no further items need to be purchased.
Payment & Security
Your payment information is processed securely. We do not store credit card details nor have access to your credit card information.